
QL601 [Preliminary]
Development Kits
Equipped with Qualcomm® Dragonwing™ QCS6490
Qualcomm® Dragonwing™ QCS6490 Processor
1 x GbE RJ-45
2 x USB 3.0 & 2 x USB 2.0
1x 4Kp60 HDMI 2.0 outputs
1 x M.2 key B for LTE/5G
2 x 4 lane MIPI CSI-2, 22 pin FPC 0.5mm Pitch
40-pin expansion header
Operating temperature: 0°C ~ 40°C (TBD)
Dimension: 98.4mm x 88.5mm x 26.5mm