Engineering Kit built with NVIDIA® Jetson AGX Orin™ Module
- 120-pin highspeed connector for MIPI SerDes cameras, such as GMSL2/FPD-link III/V-by-One® HS, to deploy in AMR application
- 1x GbE & 1x 10G RJ-45 ethernet for dozens of IP cameras streaming simultaneously in smart security application
- 10GigE Vision camera connector for smart inspection.
- 1x PCIe slot for multi-function expansion.
- 1x M.2. E key for Wi-Fi 6E, 1x mPCIe for 4G & 5G with adapter card, and 1x M.2. M key for SSD and capture
- Operating temperature: -25°C ~ 70°C (TBD)
- Dimension: 141.5mm(W) x 133.5mm(L) x 63mm(H)